SiC FOR POWER ELECTRONICS
Fabricate MOSFETs, IGBTs, and other components for high-temperature, high-frequency power electronics used in electric and hybrid vehicles, and aerospace applications.
Our conductive SiC substrates combine low resistivity, low defect density, high homogeneity, superior crystal quality, and high thermal conductivity to enable devices with low power dissipation, high-frequency operation, and good thermal stability.
Datasheet
SiC Substrates
SiC Substrates
| SILICON CARBIDE (SIC) SUBSTRATES | ||
|---|---|---|
| Physical Characteristics | ||
| Structure | Hexagonal, Single Crystal | |
| Diameter | Up to 200 mm | |
| Grades | Prime, Development, Mechanical | |
| Thermal Properties | ||
| Thermal Conductivity | 370 (W/mK) at room temperature | |
| Thermal Expansion Coefficient | 4.5 x 10-6 K -1 | |
| Specific Heat (25°C) | 0.71 (J/g°C) | |
| Additional Key Properties of Coherent SiC Substrates (typical values) | ||
| Parameter | N-type | Semi-insulating |
| Polytype | 4H | 6H |
| Dopant | Nitrogen | Vanadium |
| Resistivity | ~0.02 Ohm-cm | 109 Ohm-cm |
| Orientation | 4° off-axis | On-axis |
| Roughness, Ra | <5Å | <5Å |
| Dislocation density | ~3,000 cm-2 | 10,000 cm-2 |
| Micropipe density | < 10cm-2 | < 10 cm-2 |